TA-I TECHNOLOGY CO., LTD

Type Designation:

Ceramic Substrate

Ni Plating

Sn Plating

Resistive Element

UNIT: mm Type L W C d

RM02 0.60±0.03 0.30±0.03 0.1±0.05 0.15±0.05 0.25

RM04

+0.1

1.00

-0.05

0.50±0.05 0.20±0.10 0.25±0.10 0.35

RM06 1.60±0.10 0.80±0.10 0.30±0.20

+0.2 0.30

-0.1

RM10 2.00±0.10 1.25±0.10 0.40±0.20 0.40±0.20 0.50 RM12 3.10±0.10 1.55±0.10 0.50±0.30 0.40±0.20 0.60 RM13 3.10±0.10 2.55±0.10 0.50±0.30 0.40±0.20 0.60 RM20 5.00±0.15 2.50±0.15 0.60±0.30 0.50±0.25 0.60

Packing Type A B W F E P1P2P0D0 RM06 1.1±0.1 1.9±0.1 0.64

RM10 1.6±0.15 2.4±0.2

RM12 2.0±0.15 3.6±0.2 Paper

RM13 2.8±0.2 3.6±0.2 8.0±0.2 3.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.1

+0.1

ψ1.5

-0

0.84

8.1.2 2 mm pitch paper :

Packing Type A B W F E P1P2P0D0 RM02 0.37±0.05 0.67±0.1 2.0±0.1 2.0±0.050.37

RM04

+0.1

Packing Type A B W F E P1P2P0D0

RM20 2.8±0.2 5.3±0.2

Emboss 12.0±0.2 5.5±0.05 1.75±0.1 4.0±0.1 2.0±0.05 4.0±0.05

+0.1 ψ1.5

Paper Tape

UNIT: mm

Type ψA ψB ψC W RM02 /04 / 06 RM10 /12 /13 9.0 ± 1.0 RM20 / 25

178.0 ± 2.0

60.0 ± 1.0

13.0 ± 1.0

13.0 ± 1.0

Land pattern

Dimension ( mm

a b

02 (0201 ) 0.25~0.3 0.7~0.9

04 (0402 ) 0.50~0.6 1.4~1.6

06 (0603 ) 0.7~0.9 2.0~2.2 0.8~1.0

10 (0805 ) 1.0~1.4 3.2~3.8 0.9~1.4

12 (1206 ) 2.0~2.4 4.4~5.0 1.2~1.8

13 (1210 ) 2.0~2.4 4.4~5.0 2.3~3.5

Peak : 250

5−+℃ , 5 sec

Pre – heat Zone : 150 to 180 ℃, 90±30 sec

Soldering Zone : 230℃ or higher , 30±10 sec

12. Storage Conditions:

Temperature: 5℃~35℃,Humidity:40%~75%

13. Shelf Life:

2 years from manufacturing date.

14. ECN :

Engineering Change Notice: The customer will be informed with ECN if there is significant modification on the characteristics and materials described in Approval Sheet.